Acoustic Polymers Ltd offers a wide range of thermosetting epoxy, polyurethane and silicone encapsulation and moulding compounds for a diverse range of applications.
Encapsulation is a general term meaning to surround with insulation. The word is often used interchangeably with potting, casting or sometimes over-moulding.
The general properties of our thermosetting materials make them ideal for electrical/electronic insulation where the primary purpose of the resin is to separate the conducting elements of a device and provide protection from the operating environment.
Oven-curing resins are generally more versatile, both from a production and engineering viewpoint, having a wider range of viscosity characteristics and featuring long pot life, short cure time and having optimum physical, mechanical and electrical properties.
Filled resins offer advantages over unfilled resins in that they are generally lower cost, offer better thermal properties and inherent lower shrinkage. They do however have higher viscosities and are generally denser. Filled resins are often preferred for general casting and potting applications or where particular attributes such as thermal conductivity (TC), thermal expansion (CTE) or flame retardancy (FR) are required.
For severe thermal and mechanical shock stresses a semi-flexible or flexible systems is usually selected although filled rigid systems could also be considered in some cases.
Polyurethane resins offer better flexibility and abrasion resistance but their adhesion is usually considered lower than epoxy systems. In general the curing times of polyurethane’s are often much quicker and with significantly lower exotherm than their epoxy counterparts.